| |
L22XDL-350 |
L22XDL-520 |
| Main
Unit |
| External size |
W780 D900 H1800 |
W900 D1117 H1800 |
| Weight |
230kg |
250kg |
| Power supply |
100-240VAC |
| Power consumption |
700W |
| Operating environment |
Temperature:15-30degrees
C Humidity:15-80%RH(no condesation) |
| Camera |
Full
Digital Camera, Interface Camera Link |
| Lighting |
ring
LED light + side LED + Diffuse on-Axis LED |
| Inspection |
| Inspection method |
PatternMatching, Histogram, wave, area |
| Inspection objective |
After
solder paste, Both before/after refloe and
flow |
| Applicable components |
Chips,QFP,axial
components,DIP ICs, etc. |
| Parts Inspection items |
Missing components,offset,polarity,incorrect
components, fillet, lead, bridge, etc |
| Method |
Brightness, Hue, Saturation |
| Field of view |
Approx.
32 mm x 24 mm ・ 25.6 mm x 19.2 mm ・ 24 mm x 18 mm・16
mm x 12 mm |
| Inspection time |
0.01
sec./point (depends on the PC) |
| Conveyer |
| Conveyer speed |
10-500
mm/sec |
| PCB fixing method |
PCB interleave specification |
| Dimensions of boards inspected |
Min:50x50 Max:350x250 |
Min:50x50 Max:520x460 |
| Thickness of boards inspected |
0.6-2mm |
| Mounting limits |
Above
the board:35mm or less, Below the board:35mm or less |
Download catalogue：
PDFfile
